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Thermal Inducing Vacuum Platform

Temperature Range:

-65°C to +200°C

Chuck Diameters:

Available in 6 inch (154 mm) and 8 inch (203 mm) diameters to accommodate wafers up to 200mm in diameter.

Chuck Surfaces:

Choice of gold-plated or nickel-plated surface is standard. (Other optional surface treatments are available by contacting Temptronic.)

Outstanding Features:

  • Wide temperature range: -65°C to +200°C in a self-contained system.
  • No Liquid Nitrogen or CO2 required for cooling
  • DC Control System minimizes electrical noise
  • Temperature Accuracy: ±0.5°C (calibrated against transfer standard)
  • Temperature Stability :±0.1°C
  • Advanced ThermoChuck Design:

    • Low stray capacitance and high electrical resistance to ground: Surface Electrical Isolation: >109 ohms at 500 VDC between surface and ground at +25°C ; higher isolation configurations are available
    • Superior chuck temperature uniformity: ±0.5°C or ±0.5% of set temperature
    • Guarded ( low leakage) chuck configurations are optional

Standard Features:

  • IEEE-488 and RS232 remote interfaces
  • Proven high reliability
  • TP03000 Series Systems interface to most major manual or automatic wafer probing stations, laser trimmers and inspection stations.
  • HCFC-free and CFC-free
  • Certified Compliant 


  • Thermal cycling and steady- state thermal testing of wafers, hybrids and other flat devices
  • Low noise test applications
  • High isolation and guarded (low leakage) applications
  • Thermal characterization of standard and high power devices at high and low temperatures.
  • Moisture-free cold testing of wafers with Controlled Environment Enclosure

See the TP03000/TP03010 ThermoChuck Datasheet



Temptronic Corporation

  -- TP03500

  -- TP03000

  -- TP03010 A/B

  -- TP0315 A/B